​​Gunjan Agarwal​

  

1.  Tesla Inc.                                                                                                                                              Fremont, CA

     Senior Mechanical Design CAE Engineer                                                                              Feb. 2017 - Present

     Crash Safety

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   I. Leadership Experience - International Automotive Safety Program Management

• Leading program management for achieving 5-star vehicle safety requirements for the European New Car Assessment Programme (Euro-NCAP).

• Navigating program through multiple challenges involved in preparation for obtaining Euro-NCAP certification spread over a two-year duration, including baseline establishment, development of countermeasures, pre-official test series and final official test series in Europe.

• Steering engineering/manufacturing teams including Vehicle Test, Body-in-White, Seats, Chassis, Closures, Exteriors, Interiors, Autopilot, Battery, Quality through a tight timeline towards performance target. Bridging solutions with European test partner to effectively implement upcoming protocol revisions and more stringent assessment metrics.

   II. Technical Experience - Design for Crashworthiness and Durability

• Leading development of full-vehicle numerical simulation models using the Finite Element Method to enable improved and efficient design for safe, robust vehicle components that can withstand highly dynamic impact and loading events, targeted towards crash-worthiness and durability.

• Enabling accurate prediction of complex mechanical behavior and solving multi-physics problems by implementing multiple modeling, computational, optimization and programming platforms such as LS-DYNA, Abaqus, Ansys, Hyperworks, Digimat, Beta CAE, TOSCA, LS-OPT and Python.

 

 

 

2.    École polytechnique fédérale de Lausanne (EPFL)                                                       Lausanne, Switzerland

       Research Scientist                                                                                                              Apr 2015 – Jan 2017

       Mechanical Engineering

 

• Developing mechanical models using finite element method (FEM) simulations in AbaqusTM for small-scale, reconfigurable systems comprising of soft actuators, with applications in robotic grasping, biomedical rehabilitation, wearable systems and locomotion.

• Characterizing non-linear, hyper-viscoelastic behavior exhibited by elastomeric materials used in these actuators for the achievement of flexible, controlled and predictable actuation motion, in combinations of extension, contraction, bending, or twisting, with control inputs such as pressurized fluid.

• Validating model predictions with experimental testing for desired motion and force profiles, so as to enable rapid, efficient design of versatile actuators with embedded mechanical intelligence.

 

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3.    Massachusetts Institute of Technology                                                                                      Cambridge, MA

       Postdoctoral Associate                                                                                                     Aug 2013 – Mar 2015

       Microsystems Technology Laboratories

                               

• Worked on computational modeling, fabrication and testing of a microfluidic cooling platform to address high thermal dissipation in novel Gallium Nitride (GaN) based power microelectronic devices with applications in power amplifiers for aerospace and military.

• Developed multiphysics simulation models to characterize thermal-fluid behavior; optimized fluid flow and microfluidic channel configuration in complex material stack based on model results, to maximize cooling and achieve targeted temperature uniformity in GaN high electron mobility transistors (HEMTs).

• Designed, integrated and tested microfluidic cooling platform for high coolant flow rate capability, to enable high power density, low cost operation of on-chip electronic circuitry.

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4.   Intel Corporation                                                                                                                              Portland, OR

      Process Module, Yield and Integration Engineer                                                                  Jul 2012 – Jul 2013

      Portland Technology Development Group

 

• Worked on research and development of fabrication processes for Intel's next generation microprocessors using state-of-the-art equipment and materials; Lead scientific research enabling manufacture of innovative device architectures coupled with the realization of these architectures.

• Designed, executed and analyzed experiments throughout stages of development to meet challenging engineering specifications for new technology processes.

 

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5.    Massachusetts Institute of Technology                                                                                     Cambridge, MA

       Graduate Research Assistant                                                                                            Aug 2007 – Jun 2012

       Mechanical Engineering Department

 

• Invented new techniques for structuring selective self-assembled microsystems - combined an exploitation of microfabrication techniques and small scale mechanics, enabling the achievement of a template-based control for generating complex architectures, with potential applications in medical diagnostics, chemical sensors and metamaterials.

• Developed mechanics based models by characterizing deformations using elastic-plastic theories of contact for predicting success of self-assembly with different material combinations.

• Successfully validated theoretical models with experimental testing to assemble multiple component-substrate material combinations, with a range of mechanical properties.